От: fpga journal update [news@fpgajournal.com]
Отправлено: 27 апреля 2005 г. 4:46
Кому: Michael Dolinsky
Тема: FPGA Journal Update Vol VII No 4


a techfocus media publication :: April 26, 2005 :: volume VII, no. 04


FROM THE EDITOR

This week we look at power, which is rapidly becoming the hottest topic in FPGA design and application. With the significant leakage current challenges posed by 90nm processes, and with the continued migration of FPGAs into low-cost, low-power mass market applications, FPGA companies are facing a double-whammy of simultaneously increasing demand and difficulty. We take an in-depth look at the innovations, the architectures, and the tools that are addressing the FPGA power problem.

Thanks for reading! If there's anything we can do to make our publications more useful to you, please let us know at: comments@fpgajournal.com

Kevin Morris – Editor
FPGA and Programmable Logic Journal


LATEST NEWS

April 26, 2005

National Instruments Showcases Latest Technologies for ATE Systems at Military/Aerospace Conference Series

TSMC Unveils Nexsys 65nm Process Technology Plans; Company Gears its Industry-Leading Fabs for First Customer Products by End of 2005

FSA and IEE Announce Keynotes for IEE/FSA International Semiconductor Executive Forum; Industry Leaders Discuss Challenges Facing Today's Semiconductor Industry

Xilinx Virtex Series Surpasses Three Billion in Revenue

April 25, 2005

Kasten Chase Releases Next-Generation Crypto-Accelerator for Storage Security

Altera Joins the Metro Ethernet Forum

SMSC Reaches the Consumer Electronics Market with Its Industry First USB-IF OTG Certified Hi-Speed USB UTMI+ Stand-Alone Transceiver

Micro Memory Unveils the CoSine System-on-Chip for Real Time FPGA-based Signal Processing

Xilinx Extends Quality Leadership With ISO/TS 16949 Automotive Certification

April 20, 2005

Atmel Introduces New 0.18 Micron Structured Array Family to Support High Density FPGA Conversions

CURRENT FEATURE ARTICLES

Power
Suddenly, We Care
E. Thomas Hart
Focusing QuickLogic's Energy
Square Root of Two to the Fortieth
Four Decades of Moore
A Bevy of Boards
Selecting for Success
Cray Goes FPGA
Algorithm Acceleration in the New XD1
The Real Fear Factor
by Lauro Rizzatti, EVE-USA Emulation and Verification Engineering (EVE)
Clock Watching

Unraveling Complex Clocking
Free Tool Friday
How Good are FPGA Vendor Tools?


Power
Suddenly, We Care

For years it was like a slogan. "FPGAs are nice, but they're power hogs." For the customers that kept the lights on, however, buying thousands of FPGAs for backplane-based, rack-mounted equipment with monster power supplies and plenty of cooling, considerations like performance, I/O, and density far outweighed power as a design-in concern. If a new FPGA family offered a 50% performance increase or doubled the LUT count over the previous generation, damn the heatsinks and full-speed ahead. Designers rolled FPGAs in with reckless abandon.

Today, however, forces are conspiring to bring power concerns off of the back burner and into the forefront of FPGA design consideration. As the day approaches when firing up your FPGA-based network router threatens to cause brown-out conditions in neighboring counties, even the traditional FPGA consumer may think it's time to cool things down a bit. With high-end devices today based on 90nm processes, dynamic power consumption per gate has continued to drop, but it is largely offset by increased density. Additionally, static or leakage current as a percentage of total power consumption is on the rise due to smaller geometries. The net result is a generation of devices that require careful attention to power, from their initial design through their final application in FPGA-based systems.

"Even the fellows in wireless base stations and wired-access markets are feeling the power problem," says Anil Telikepalli – Marketing Manager for Virtex Solutions at Xilinx. "When infrastructure equipment is outside in sun, like the green boxes you see alongside the roads, temperatures in the chassis can reach 50-60 degrees C, so junction temperatures can easily rise to 85 degrees. At that temperature, static power goes up significantly, generating even more heat." [more]

ANNOUNCEMENTS

Find a better job. Browse FPGA Journal’s new job listings to find challenging and rewarding opportunities with the FPGA industry’s top companies. Journal Jobs is specifically for FPGA professionals – more of what you’re looking for, less of what you’re not.
Browse now!


Hire the best FPGA talent in the industry with FPGA Journal Job Listings. Starting this month you can reach 30,000 active FPGA professionals by advertising your FPGA-related positions in Journal Jobs.
Click here for info.


Visit Techfocus Media


You're receiving this newsletter because you subscribed at our web site www.fpgajournal.com.
If someone forwarded this newsletter to you and you'd like to receive your own free subscription, go to: www.fpgajournal.com/update.
If at any time, you would like to unsubscribe, send e-mail to unsubscribe@fpgajournal.com. (But we hope you don't.)
If you have any questions or comments, send them to comments@fpgajournal.com.

All material copyright © 2003-2005 techfocus media, inc. All rights reserved.
Privacy Statement